Ufs 3.1 Pinout !free! Info

⚠️ Important Note: UFS 3.1 uses M-PHY 4.1 (Gear 4) and UniPro 1.8. While the pinout is physically compatible with UFS 2.x, high-speed signals (Rx/Tx) require stricter PCB layout. Always verify with the specific component datasheet (e.g., Samsung, Kioxia, Micron, SK Hynix).

Reference Clock (REF_CLK)

  • Frequency: 26 MHz or 19.2 MHz (host configurable).
  • Must be low-jitter (<5 ps RMS). Without it, the UFS device will not exit reset.

Conclusion

The UFS 3.1 pinout is not just a random arrangement of balls—it is a carefully engineered high-speed serial interface that demands respect for differential signaling, multiple power domains, and vendor-specific strapping. Whether you are designing a PCB, repairing a flagship device, or attempting forensic data extraction, understanding the key pins (REF_CLK, RST_n, RX/TX pairs, and power rails) will save you hours of troubleshooting and prevent costly chip damage. Always verify your pinout against the component datasheet before applying power, and remember: in the world of UFS, assumptions are the mother of all failures.

Universal Flash Storage (UFS) 3.1 is a high-performance storage interface standard commonly used in modern smartphones and automotive systems to provide high-speed data transfer and improved power efficiency. Common UFS 3.1 Pinout Configurations

UFS 3.1 chips typically use a Ball Grid Array (BGA) package, with the most common being BGA 153 and BGA 254. 1. BGA 153 Pinout (Standard Mobile/Embedded)

UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global

UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global. samsung.com ufs 3.1 pinout

UFS 3.1 typically utilizes a BGA 153 (153-ball) package with an 11.5mm x 13.0mm footprint. Unlike the parallel interface of eMMC, UFS uses a serial differential interface (MIPI M-PHY) to achieve significantly higher speeds—over 1,500 MB/s for UFS 3.1. ⚡ Critical Signal Groups

The UFS 3.1 interface is categorized into power, high-speed differential data, and control lines. Signal Type Description Data (Transmit) TXP, TXN Differential transmit pair (Host to Device) Data (Receive) RXP, RXN Differential receive pair (Device to Host) Control RST_N, REF_CLK

Reset signal and Reference Clock for high-speed synchronization Power (Core) VCC Primary supply voltage (typically 2.5V – 3.3V) Power (I/O) VCCQ, VCCQ2

I/O supply voltages (typically 1.2V for VCCQ and 1.8V for VCCQ2) 🔍 ISP (In-System Programming) Pinout

For data recovery or forensic chip-off/ISP work, five primary wires are usually required to establish communication with tools like EasyJtag or UFI: TXP / TXN: Data transmission pairs. RXP / RXN: Data reception pairs. GND: Ground connection. ⚠️ Important Note : UFS 3

RST: Reset (often required for stable detection on newer chips).

Note: For ISP, power is often supplied via the device's USB port (battery connected) rather than external VCC wires to avoid current supply issues. UFS | eStorage | Samsung Semiconductor Global

Its expanded capacity and enhanced endurance support diverse automotive workloads. * Interface. G4 2Lane. * Package Size. 11.5x13. samsung.com UNIVERSAL FLASH STORAGE (UFS 3.1) - Mouser Electronics

7. Finding Exact Pinout for Your Chip

UFS 3.1 pinout varies slightly by vendor. Search for the datasheet using:

  • Part number prefix examples:

    • Samsung: KLUDG4Uxxx, KLUEG8Uxxx
    • Kioxia: THGJFxT0xxx
    • Micron: MTFC128Gxxx
    • SK Hynix: H9HQ53xxx

  • Request: “BGA 153 ball map” + “UFS 3.1 pin assignment” from vendor’s NDA documentation.

2. Detailed Pinout Table (Key Balls)

Based on typical 11.5x13mm 153-ball package (0.5mm pitch). Always verify with device-specific datasheet.

| Ball # | Signal | I/O | Description | Voltage | | :--- | :--- | :--- | :--- | :--- | | A1 | VSS | GND | Ground | 0V | | B1 | VCCQ | Power | I/O & controller logic supply | 1.2V or 1.8V | | C1 | RST_n | Input | Hardware reset (active low) | 1.2/1.8V | | D2 | REF_CLK | Input | Reference clock (26MHz typical) | 1.2/1.8V | | E3 | RXP | Input | Receive Lane Positive (from host) | Differential | | E2 | RXN | Input | Receive Lane Negative | Differential | | F3 | TXP | Output | Transmit Lane Positive (to host) | Differential | | F2 | TXN | Output | Transmit Lane Negative | Differential | | G1 | VCC | Power | NAND flash core supply | 3.3V | | K5 | CGE | Output | Combo Gear Enable / Power Mode Indication | 1.2/1.8V | | Remaining | VSS | GND | Multiple ground balls (surround signal groups) | 0V |

Note: UFS 3.1 is backward compatible with UFS 2.1 pinouts, but VCCQ2 (1.2V for advanced low-power states) is more common. Missing VCCQ2 may prevent HS-G4 (Gear 4) speeds.

Power Sequence (Strictly Defined)

  1. Apply VCC (3.3V) first.
  2. Then apply VCCQ (1.2/1.8V) and optionally VCCQ2 (1.2V) within 10ms.
  3. De-assert RST_n after all supplies are stable (>1ms delay).

Contact us:

FOLLOW US